SST26VF016BEUI datasheet(51/78 Pages) MICROCHIP

部品番号	SST26VF016BEUI

部品情報	16 Mbit Serial Quad I/O (SQI) Flash Memory with EUI-48™ and EUI-64™ Identifier

PDF	78 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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51 / 78 page

 2019 Microchip Technology Inc.

DS20006153A-page 51

SST26VF016BEUI

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

2.45

3.15

MILLIMETERS

1.27 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

1.60

0.60

NOM

Contact Pad Spacing

5.40

Contact Pad to Center Pad (X8)

0.68

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-1136 Rev A

8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]

With 3.10x2.41 mm Exposed Pad

ØV

Contact Pad to Contact Pad (X6)

0.67

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