Package information

STTH1R02

6/8

3

Package information

Epoxy meets UL94, V0

Table 5.

DO-41 Dimensions

Figure 13.

SMA footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.1

5.20

0.160

0.205

B

2

2.71

0.080

0.107

C25.4

1

D

0.712

0.863

0.028

0.034

Table 6.

SMA dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A1

1.90

2.03

0.075

0.080

A2

0.05

0.20

0.002

0.008

b

1.25

1.65

0.049

0.065

c

0.15

0.41

0.006

0.016

E

4.80

5.60

0.189

0.220

E1

3.95

4.60

0.156

0.181

D

2.25

2.95

0.089

0.116

L

0.75

1.60

0.030

0.063

ØD ØB

A

CC

1.67

4.94

1.73

1.48

1.73