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LSF0102DDFR データシート(PDF) 8 Page - Texas Instruments

部品番号 LSF0102DDFR
部品情報  LSF010x 1/2/8 Channel Auto-Bidirectional Multi-Voltage Level Translator for Open- Drain and Push-Pull Applications
PDF  57 Pages
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
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LSF0102DDFR データシート(HTML) 8 Page - Texas Instruments

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6.5 Thermal Information
THERMAL METRIC(1)
LSF0102
UNIT
DCU (US8)
DCT (SM8)
DQE (X2SON)
YZT (DSBGA)
DDF (SOT-23)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
210.1
189.6
246.5
125.5
243.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
89.1
119.6
149.1
1.0
168.7
°C/W
RθJB
Junction-to-board thermal resistance
88.8
102.1
100.0
62.7
157.6
°C/W
ψJT
Junction-to-top characterization parameter
8.3
44.5
17.1
3.4
45.9
°C/W
ψJB
Junction-to-board characterization
parameter
88.4
101.0
99.8
62.7
157.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
n/a
n/a
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.6 Thermal Information
THERMAL METRIC(1)
LSF0108
UNIT
RKS (VQFN)
PW (TSSOP)
DGS (VSSOP)
20 PINS
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
49.3
106.6
123.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
45.9
41.0
62.2
°C/W
RθJB
Junction-to-board thermal resistance
20.6
57.6
77.4
°C/W
ψJT
Junction-to-top characterization parameter
2.5
4.2
8.8
°C/W
ψJB
Junction-to-board characterization parameter
20.6
47.0
77.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.4
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
LSF0108
SDLS966L – DECEMBER 2013 – REVISED DECEMBER 2022
www.ti.com
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