9.4

UFDFPN8 (DFN8) package information

This UFDFPN is a 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package.

Figure 19. UFDFPN8 - Outline

Top view

Pin #1

ID marking

Side view

Seating plane

eee

ccc

C

C

C

C

C

B

A

1 2

N

D

E

aaa

aaa

A

A1

A3

2x

2x

Datum A

Terminal tip

Detail “A”

Even terminal

L1

L3

L

e

e/2

Pin #1

ID marking

Bottom view

See Detail “A”

e

e

1 2

ND-1 x

D2

L1

L3

E2

K

L

b

Package UFDFN8 (package code ZW)

1.

Maximum package warpage is 0.05 mm.

2.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

3.

Drawing is not to scale.

4.

The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

M24C01/02-W M24C01/02-R M24C02-F

UFDFPN8 (DFN8) package information

DS9398 - Rev 7

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