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BAS55 データシート(PDF) 2 Page - NXP Semiconductors |
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BAS55 データシート(HTML) 2 Page - NXP Semiconductors |
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2 / 7 page ![]() 1996 Sep 10 2 Philips Semiconductors Product specification High-speed diode BAS55 FEATURES • Small plastic SMD package • High switching speed: max. 6 ns • Continuous reverse voltage: max. 60 V • Repetitive peak reverse voltage: max. 60 V • Repetitive peak forward current: max. 600 mA. APPLICATIONS • High-speed switching in surface mounted circuits. DESCRIPTION The BAS55 is a high-speed switching diode fabricated in planar technology, and encapsulated in the small rectangular plastic SMD SOT23 package. PINNING PIN DESCRIPTION 1 anode 2 not connected 3 cathode Fig.1 Simplified outline (SOT23) and symbol. Marking code: L5p. handbook, halfpage 21 3 MAM185 2 n.c. 1 3 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Note 1. Device mounted on an FR4 printed-circuit board. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRRM repetitive peak reverse voltage − 60 V VR continuous reverse voltage − 60 V IF continuous forward current see Fig.2; note 1 − 250 mA IFRM repetitive peak forward current − 600 mA IFSM non-repetitive peak forward current square wave; Tj =25 °C prior to surge; see Fig.4 t=1 µs − 9A t = 100 µs − 3A t = 10 ms − 1.7 A Ptot total power dissipation Tamb =25 °C; note 1 − 250 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C |
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