PID9v-604e Hardware Specifications

21

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

1.7.2 Mechanical Dimensions of the CBGA Package

Figure 10 provides the mechanical dimensions and bottom surface nomenclature of the IBM and Motorola

CBGA package.

Figure 10. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package

NOTES:

1. DIMENSIONINGANDTOLERANCINGPERASMEY14.5M,1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOPSIDEA1CORNERINDEXISAMETALIZEDFEATUREWITH

VARIOUS SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING FROM THE ARRAY.

DIM

MIN

MAX

MILLIMETERS

A

2.65

3.20

A1

0.79

0.99

A2

1.10

1.30

b

0.82

0.93

D

21.00 BSC

D1

5.00

16.00

e

1.27 BSC

E

21.00 BSC

E1

5.00

16.00

0.2

B

C

255X

D

2X

A1 CORNER

E

e

E1

D1

0.2

2X

B

A

123456789 10 11 12 13 14 15 16

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

e/2

A

0.3

C

0.15

b

e/2

A

A1

A2

C

0.15 C

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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