7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Power Supply Voltage

VCC

–0.3

5.5

V

Output Pin Voltage

OUT

GND – 0.3

VCC + 0.3

Output Pin current

OUT

–5

5

mA

Magnetic Flux Density, BMAX

Unlimited

T

Junction temperature, TJ

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum

Ratings do not imply functional operation of the device at these or any other conditions beyond those listed

under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within

the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,

functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins((1))

±5500

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins((2))

± 500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Power supply voltage

1.65

5.5

V

Vo

Output voltage

0

5.5

V

Io

Output current

–5

5

mA

TA

Ambient temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

TMAG5131-Q1

UNIT

SOT-23 (DBZ)

3 PINS

RθJA

Junction-to-ambient thermal resistance

227.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

122.7

RθJB

Junction-to-board thermal resistance

61.2

ΨJT

Junction-to-top characterization parameter

21.3

ΨJB

Junction-to-board characterization parameter

60.8

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMAG5131-Q1

SLYS050 – APRIL 2023

www.ti.com

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