December 4, 2006 23569A5

Am29PDS322D

49

D A TA

SH EET

REVISION SUMMARY

Revision A (December 4, 2000)

Initial release.

Revision A+1 (February 16, 2001)

Ordering Information

Added “U” designator to package marking. Deleted

burn-in option.

Revision A+2 (August 31, 2001)

Autoselect Command Sequence

Modified section to point to appropriate tables for au-

toselect functions.

Revision A+3 (February 18, 2002)

Global

Removed “Advance Information” designation from

data sheet.

Erase Suspend/Erase Resume Commands

Noted in the third paragraph that unlock bypass pro-

gramming is not allowed when the device is erase sus-

pended.

Revision A+4 (August 7, 2002)

Distinctive Characteristics

Removed “Supports Common Flash Memory Interface

(CFI))

Table 10. Am29PDS322D Command Definitions

Changed the Command Cycle Device ID cycle from 6

to 4.

Revision A5 (December 4, 2006)

Global

Removed Advance Information designation from docu-

ment (inadvertently restored in Revision A+4).

AC Characteristics

Erase and Program Operations table: Changed t

BUSY

to a maximum specification.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 2000–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are

trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.