MCP16331 datasheet(41/48 Pages) MICROCHIP

部品番号	MCP16331

部品情報	High-Voltage Input Integrated Switch Step-Down Regulator

PDF	48 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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41 / 48 page

 2014-2021 Microchip Technology Inc.

DS20005308D-page 41

MCP16331

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MNY Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

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