Data Sheet S12581EJ1V0DS00

13

µµµµ PD16640B

9. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met for mounting conditions of the

µ PD16640B.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done

under different conditions.

µµµµ PD16640BN-xxx : TCP(TAB package)

Mounting Condition

Mounting Method

Condition

Soldering

Heating tool 300 to 350°C, heating for 2 to 3 seconds: pressure 100 g (per

solder)

Thermocompression

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100°C; pressure 3 to 8 kg/cm

2; time 3 to 5 secs.

Real bonding 165 to 180°C; pressure 25 to 45 kg/cm

2, time 30 to 40 secs.

(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo

Bakelite, Ltd.)

Caution

To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.