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LP87702 データシート(PDF) 96 Page - Texas Instruments |
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LP87702 データシート(HTML) 96 Page - Texas Instruments |
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96 / 99 page ![]() A A www.ti.com PACKAGE OUTLINE C 32X 0.3 0.2 3.45 0.1 32X 0.5 0.3 0.9 MAX (0.2) TYP 0.05 0.00 28X 0.5 2X 3.5 2X 3.5 (0.05) 0.1 MIN A 5.1 4.9 B 5.1 4.9 VQFN - 0.9 mm max height RHB0032N PLASTIC QUAD FLATPACK - NO LEAD 4222893/B 02/2018 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD 33 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SECTION A-A TYPICAL SCALE 3.000 A-A 30.000 |
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