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ams Datasheet

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[v1-01] 2018-Mar-14

TCS3772 − Pack age Drawings & Mark ings

Figure 50:

Package FN – Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerance of

± 75 μm.

3. Double-Half Etch (DHE) is 97

± 20 μm. Non-DHE is 203 ± 8 μm.

4. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

5. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

6. This package contains no lead (Pb).

7. This drawing is subject to change without notice.

Package Drawings & Markings

Green

RoHS