TSL25713 datasheet(32/39 Pages) OSRAM

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ams Datasheet

Page 31

[v1-01] 2018-Mar-27

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TSL2571 − Manufacturing Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 36:

Soldier Reflow Profile

Figure 37:

Solder Reflow Profile Graph

Note(s):

1. Not to scale - for reference only.

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)t1

Max 60 s

Time above 230°C (T2)

Max 50 s

Time above Tpeak −10°C (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max −5°C/s

Manufacturing Information

tsoak

Tpeak

Not to scale — for reference o

Time (s)

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