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TM1102 データシート(PDF) 4 Page - NXP Semiconductors |
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TM1102 データシート(HTML) 4 Page - NXP Semiconductors |
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4 / 7 page ![]() 1996 May 09 4 Philips Semiconductors Product specification PNP transistor/Schottky-diode module PZTM1102 Notes 1. Measured under pulsed conditions: tp ≤ 300 µs; δ ≤ 0.01. 2. Limiting value for Tj = 125 °C; Tj = 150 °C with reverse current applied is not allowed as this may cause thermal runaway leading to thermal destruction of the diode. A peak junction temperature of Tj = 150 °C is only allowed with forward voltage applied. THERMAL CHARACTERISTICS Note 1. Refer to SOT223 standard mounting conditions. Schottky barrier diode VF forward voltage IF = 100 mA; note 1 − 330 mV IF = 100 mA; Tamb = −55 to +150 °C; note 1 − 400 mV IF = 1 A; note 1 − 500 mV IF = 1 A; Tamb = −55 to +150 °C; note 1 − 560 mV IR reverse current VR = 40 V; note 1 − 300 µA VR = 40 V; Tj = 125 °C; Tamb = −55 to +150 °C; note 1 − 35(2) mA IR reverse current VR = 10 V; note 1 − 40 µA VR = 10 V; Tj = 125 °C; Tamb = −55 to +150 °C; note 1 − 15(2) mA Cj junction capacitance VR = 0 V; f = 1 MHz − 250 pF SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient (for the transistor) note 1 100 K/W Rth j-a thermal resistance from junction to ambient (for the Schottky diode) note 1 250 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT |
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