SST25VF040B_07 datasheet(22/30 Pages) SST

22 / 30 page

Data Sheet

4 Mbit SPI Serial Flash

SST25VF040B

S71295-02-000

7/07

ELECTRICAL SPECIFICATIONS

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum

Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation

of the device at these conditions or conditions greater than those defined in the operational sections of this data

sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V

Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. Output shorted for no more than one second. No more than one output shorted at a time.

OPERATING RANGE

Range

Ambient Temp

VDD

Commercial

0°C to +70°C

2.7-3.6V

Industrial

-40°C to +85°C

2.7-3.6V

AC CONDITIONS OF TEST

Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns

Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF

See Figures 26 and 27

TABLE

8: DC Operating Characteristics

Symbol

Parameter

Limits

Test Conditions

Min

Max

Units

IDDR

Read Current

CE#=0.1 VDD/0.9 VDD@25 MHz, SO=open

IDDR2

Read Current

CE#=0.1 VDD/0.9 VDD@50 MHz, SO=open

IDDW

Program and Erase Current

CE#=VDD

ISB

Standby Current

µA

CE#=VDD, VIN=VDD or VSS

ILI

Input Leakage Current

µA

VIN=GND to VDD, VDD=VDD Max

ILO

Output Leakage Current

µA

VOUT=GND to VDD, VDD=VDD Max

VIL

Input Low Voltage

0.8

VDD=VDD Min

VIH

Input High Voltage

0.7 VDD

VVDD=VDD Max

VOL

Output Low Voltage

0.2

IOL=100 µA, VDD=VDD Min

VOL2

Output Low Voltage

0.4

IOL=1.6 mA, VDD=VDD Min

VOH

Output High Voltage

VDD-0.2

IOH=-100 µA, VDD=VDD Min

T8.0 1295

TABLE

9: Recommended System Power-up Timings

Symbol

Parameter

Minimum

Units

TPU-READ1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

VDD Min to Read Operation

µs

TPU-WRITE1

VDD Min to Write Operation

µs

T9.0 1295

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