© 2005 Microchip Technology Inc.

DS21203N-page 23

24AA256/24LC256/24FC256

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products

manufactured before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please

visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences

and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of

the following:

1.

Your local Microchip sales office

2.

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3.

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

24AA256:

EEPROM

24AA256T:

EEPROM Tape and Reel)

24LC256:

EEPROM

24LC256T:

EEPROM Tape and Reel)

24FC256:

EEPROM

24FC256T:

EEPROM Tape and Reel)

Temperature

Range:

I=

-40

°C to +85°C

E=

-40

°C to +125°C

Package:

P

= Plastic DIP (300 mil body), 8-lead

SN

= Plastic SOIC (150 mil body), 8-lead

SM

= Plastic SOIC (208 mil body), 8-lead

ST

= Plastic TSSOP (4.4 mm), 8-lead

MF

= Dual, Flat, No Lead (DFN)(6x5 mm

body), 8-lead

MS

= Plastic Micro Small Outline (MSOP),

8-lead

Lead Finish:

Blank = Pb-free – Matte Tin (see Note 1)

G

= Pb-free – Matte Tin only

Examples:

a)

24AA256-I/P:

Industrial Temp.,

1.8V, PDIP package.

b)

24AA256T-I/SN: Tape and Reel,

Industrial Temp., 1.8V, SOIC

package.

c)

24AA256-I/ST:

Industrial Temp.,

1.8V, TSSOP package.

d)

24AA256-I/MS:

Industrial Temp.,

1.8V, MSOP package.

e)

24LC256-E/P:

Extended Temp.,

2.5V, PDIP package.

f)

24LC256-I/SN:

Industrial Temp.,

2.5V, SOIC package.

g)

24LC256T-I/SN: Tape and Reel,

Industrial Temp., 2.5V, SOIC

package.

h)

24LC256-I/MS:

Industrial Temp,

2.5V, MSOP package.

i)

24FC256-I/P:

Industrial Temp,

1.8V, High Speed, PDIP package.

j)

24FC256-I/SN:

Industrial Temp,

1.8V, High Speed, SOIC package.

k)

24FC256T-I/SN: Tape and Reel,

Industrial Temp, 1.8V, High Speed,

SOIC package

l)

24LC256T-I/STG: Industrial Temp,

2.5V, TSSOP package, Tape & Reel,

Pb-free

m) 24LC256-I/PG:

Industrial Temp,

2.5V, PDIP package, Pb-free

X

Lead

Finish