MCP23017-ESLASHML datasheet(37/48 Pages) MICROCHIP

37 / 48 page

DS21952B-page 37

MCP23017/MCP23S17

3.0

PACKAGING INFORMATION

3.1

Package Marking Information

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

28-Lead SOIC

YYWWNNN

Example:

28-Lead PDIP (Skinny DIP)

Example:

XXXXXXXXXXXXXXXXX

28-Lead SSOP

YYWWNNN

XXXXXXXXXXXX

Example:

0648256

MCP23017

28-Lead QFN

Example:

E/SS^^3

XXXXXXXXXXXXXXXXX

YYWWNN

MCP23017-E/SP^^

0648256

MCP23017-E/SO^^3

XXXXXXXX

YYWWNNN

23017

E/ML^^

0648256

MCP23017-E/ML データシート(PDF) 37 Page - Microchip Technology

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