5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

7

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Section 5.2 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 Recommended Operating Conditions(1)

SN54HC166

SN74HC166

UNIT

MIN

NOM

MAX

MIN

NOM

MAX

VCC

Supply voltage

2

5

6

2

5

6

V

VIH

High-level input voltage

VCC = 2 V

1.5

1.5

V

VCC = 4.5 V

3.15

3.15

VCC = 6 V

4.2

4.2

VIL

Low-level input voltage

VCC = 2 V

0.5

0.5

V

VCC = 4.5 V

1.35

1.35

VCC = 6 V

1.8

1.8

VI

Input voltage

0

VCC

0

VCC

V

VO

Output voltage

0

VCC

0

VCC

V

Δt/Δv(2)

Input transition rise/fall time

VCC = 2 V

1000

1000

ns

VCC = 4.5 V

500

500

VCC = 6 V

400

400

TA

Operating free-air temperature

−55

125

−40

85

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(2)

If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state

from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device;

however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

DB (SSOP)

N (PDIP)

NS (SO)

PW (TSSOP)

UNIT

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal

resistance

(1)

73

82

67

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

SN54HC166, SN74HC166

SCLS117E – DECEMBER 1982 – REVISED FEBRUARY 2022

www.ti.com

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