SAM9X75 SiP

Mechanical Characteristics

Data Sheet

© 2023 Microchip Technology Inc. and its subsidiaries

DS60001827B - 26

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2022 Microchip Technology Inc.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Terminal A1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Ball Diameter

Overall Width

Ball Array Width

Pitch

Ball Height

Units

Dimension Limits

A1

A

b

E2

e

E

N

0.80 BSC

0.35

–

–

0.40

12.80 BSC

–

0.21

16.00 BSC

MILLIMETERS

MIN

NOM

243

0.45

1.23

0.312

MAX

Overall Length

Ball Array Length

D

D2

16.00 BSC

12.80 BSC

Mold Thickness

M

0.56

0.51

0.61

243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA]

Microchip Technology Drawing C04-21556 Rev B