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PPC405GPR-3JB266 データシート(PDF) 38 Page - Applied Micro Circuits Corporation

部品番号 PPC405GPR-3JB266
部品情報  Power PC 405GPr Embedded Processor
PDF  57 Pages
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メーカー  AMCC [Applied Micro Circuits Corporation]
ホームページ  http://www.amcc.com
Logo AMCC - Applied Micro Circuits Corporation

PPC405GPR-3JB266 データシート(HTML) 38 Page - Applied Micro Circuits Corporation

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405GPr – Power PC 405GPr Embedded Processor
38
AMCC
Revision 2.04 – September 7, 2007
Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +1.95
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage
AVDD
0 to +1.95
V
Input Voltage (1.8V CMOS receivers)
VIN
-0.6 to VDD + 0.45
V
Input Voltage (3.3V LVTTL receivers)
VIN
-0.6 to OVDD + 0.6
V
Input Voltage (5.0V LVTTL receivers)
VIN
-0.6 to OVDD + 2.4
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Notes:
1. All specified voltages are with respect to GND.
2. Empirical data indicates that all chip voltages should begin to ramp-up within 1 ms of each other. There should never be voltage present
at the I/O pins before OVDD is within operating range.
Package Thermal Specifications
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C3. Thermal resistance values for the
E-PBGA packages (leaded and lead-free) in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
35mm, 456-balls—Case-to-Ambient1
θ
CA
14
13
12
°C/W
27mm, 456-balls—Junction-to-Case
θ
JC
222
°C/W
27mm, 456-balls—Case-to-Ambient1
θ
CA
18
16
15
°C/W
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.
3. 333MHz operated at 266MHz or less can operate at +105°C.



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