ML13156

LANSDALE Semiconductor, Inc.

(ML13156-6P)

PLASTIC PACKAGE

CASE 751E–04

(SO–24L)

ISSUE E

OUTLINE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

–A–

–B–

P

12X

D

24X

12

13

24

1

M

0.010 (0.25)

S

A

M

0.010 (0.25)

T

–T–

G

22X

SEATING

PLANE

K

C

M

F

J

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

15.25

15.54

0.601

0.612

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.41

0.90

0.016

0.035

G

1.27 BSC

0.050 BSC

J

0.23

0.32

0.009

0.013

K

0.13

0.29

0.005

0.011

M

0

°

8

°

0

°

8

°

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.

www.lansdale.com

Page 21 of 21

Issue A