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STW81101ATR データシート(PDF) 45 Page - STMicroelectronics |
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STW81101ATR データシート(HTML) 45 Page - STMicroelectronics |
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45 / 48 page  STW81101 Package mechanical data 45/48 10 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages, which have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com. Figure 37. VFQFPN28 mechanical drawing ( Note 1) Note: 1 VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. (Very thin: A=1.00 Max) 2 Details of the terminal 1 identifier are optional, but if given, must be located on the top surface of the package by using either a mold or marked features. 7655832 A |
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