3

STM32CubeU5 architecture overview

The STM32CubeU5 MCU package solution is built around three independent levels that easily interact as

described in Figure 2.

Figure 2. STM32CubeU5 MCU package architecture

Library and protocol based components

(for example RTOS™, USB PD)

Examples

BSP drivers

Core drivers (optional)

Hardware abstraction layer (HAL)

HAL

Level 0

Level 1

Level 2

Low-layer (LL)

Evaluation board and Discovery kit demonstration

Applications

3.1

Level 0

This level is divided into three sublayers:

•

Board support package (BSP)

•

Hardware abstraction layer (HAL)

–

HAL peripheral drivers

–

Low-layer drivers

•

Basic peripheral usage examples

3.1.1

Board support package (BSP)

This layer offers a set of APIs relative to the hardware components in the hardware boards. The hardware boards

can be LCD, audio, microSD™, and MEMS drivers. It is composed of two parts:

•

Component

This is the driver relative to the external device on the board and not to the STM32. The component driver

provides specific APIs to the BSP driver external components and could be portable on any other board.

•

BSP driver

It allows linking the component drivers to a specific board and provides a set of user-friendly APIs. The API

naming rule is BSP_FUNCT_Action().

Example: BSP_LED_Init(), BSP_LED_On()

UM2883

STM32CubeU5 architecture overview

UM2883 - Rev 4

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