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ACT4533AB データシート(PDF) 2 Page - Qorvo, Inc

部品番号 ACT4533AB
部品情報  Wide Input Sensorless CC/CV Step-Down DC/DC Converter
PDF  19 Pages
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メーカー  QORVO [Qorvo, Inc]
ホームページ  https://www.qorvo.com/
Logo QORVO - Qorvo, Inc

ACT4533AB データシート(HTML) 2 Page - Qorvo, Inc

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Classification | PRIVATE
Data Sheet Rev. B, January 2025 | Subject to change without notice
2 of 19
www.qorvo.com
© 2025 Qorvo US, Inc. All rights reserved. Qorvo Confidential & Proprietary Information
ACT4533A/B
Wide Input Sensorless CC/CV Step-Down DC/DC Converter
ORDERING INFORMATION
PART NUMBER
OPERATION AMBIENT
TEMPERATURE RANGE
OVP/EN PIN
PACKAGE
PINS
PACKING
ACT4533AYH-T
-40 °C to 85 °C
OVP
SOP-8EP
8
TAPE & REEL
ACT4533BYH-T
-40 °C to 85 °C
OVP/EN
SOP-8EP
8
TAPE & REEL
PIN CONFIGURATION
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
1
HSB
High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver. Connect a
22 nF capacitor from HSB pin to SW pin.
2
IN
Power Supply Input. Bypass this pin with a 10 µF ceramic capacitor to GND, placed as close to the
IC as possible.
3
SW
Power Switching Output to External Inductor.
4
GND
Ground. Connect this pin to a large PCB copper area for best heat dissipation. Return FB, COMP, and
ISET to this GND, and connect this GND to power GND at a single point for best noise immunity.
5
FB
Feedback Input. The voltage at this pin is regulated to 0.808 V. Connect to the resistor divider between
output and GND to set the output voltage.
6
COMP
Error Amplifier Output. This pin is used to compensate the converter.
7
EN/OVP
ACT4533A: OVP input. If the voltage at this pin exceeds 0.8 V, the IC shuts down the high-side switch.
There is a 4 µA pull-up current at this pin.
ACT4533B: EN/OVP input. If the voltage at this pin is below 0.65 V, the IC remains shut-off, if the
Voltage at this pin exceeds 2.26 V, the IC shuts down high side switch. There is a 4 µA pull-up current
at this pin.
8
ISET
Output Current Setting Pin. Connect a resistor from ISET to GND to program the output current.
Exposed Pad Heat Dissipation Pad. Connect this exposed pad to a large ground copper area with copper and vias.



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