TDA7546 datasheet(66/68 Pages) STMICROELECTRONICS

66 / 68 page

Package information

TDA7546

66/68

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 26.

TQFP80LS mechanical data & package dimensions

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.22

0.32

0.38

0.009

0.013

0.015

0.09

0.20

0.003

0.008

16.00

0.630

14.00

0.551

12.35

0.295

0.65

0.0256

16.00

0.630

14.00

0.551

12.35

0.486

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.0393

K3.5

°(min.), 7°(max.)

LQFP80

(14x14x1.40mm)

Seating Plane

TQFP80L

0.10mm

.004

PIN 1

IDENTIFICATION

0.25mm

Gage plane

OUTLINE AND

MECHANICAL DATA

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