MIC5166

DS20006085B-page 6

 2018 - 2019 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

TJ

–40

—

+125

°C

—

Maximum Junction Temperature

TJ(MAX)

—

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10 sec.

Storage Temperature Range

TS

–65

—

+150

°C

—

Package Thermal Resistances

Thermal Resistance, 3x3 DFN 10-Ld

JC

—28.7

—

°C/W

—

Thermal Resistance, 3x3 DFN 10-Ld

JA

—60.7

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.