COUT

VOUT

VIN

GND PLANE

CIN

Represents via used for

application specific connections

IN

GND

OUT

NC

EN

NC

COUT

VOUT

VIN

GND PLANE

CIN

Represents via used for

application specific connections

IN

GND

EN

NC

OUT

16

TLV702-Q1

SLVSC35D – AUGUST 2013 – REVISED JULY 2019

www.ti.com

Product Folder Links: TLV702-Q1

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Copyright © 2013–2019, Texas Instruments Incorporated

Layout Guidelines (continued)

10.1.2 Package Mounting

Solder pad footprint recommendations for the TLV702-Q1 are available from the TI website at www.ti.com. The

recommended layout examples for the DDC and DSE packages are shown in Figure 27 and Figure 28,

respectively.

10.2 Layout Examples

Figure 27. Layout Example for the DDC and DBV Packages

Figure 28. Layout Example for the DSE Package