TL082ACD datasheet(10/78 Pages) TI2

10 / 78 page

5.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TL081xx

UNIT

(SOIC)

DCK

(SC70)

DBV

(SOT-23)

(PDIP)

(SO)

8 PINS

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

158.8

217.5

212.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

98.6

113.1

111.1

–

°C/W

RθJB

Junction-to-board thermal resistance

102.3

63.8

79.4

–

°C/W

ψJT

Junction-to-top characterization parameter

45.8

34.8

51.8

–

°C/W

ψJB

Junction-to-board characterization parameter

101.5

63.5

79.0

–

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metric application report.

5.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TL082xx

UNIT

(SOIC)

DDF

(SOT-23)

(LCCC)

(CDIP)

(PDIP)

(SO)

(TSSOP)

(CFP)

8 PINS

20 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient

thermal resistance

147.8

181.5

–

200.3

169.8

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

88.2

112.5

5.61

15.05

–

89.4

62.1

°C/W

RθJB

Junction-to-board

thermal resistance

91.4

98.2

–

131.0

176.2

°C/W

ψJT

Junction-to-top

characterization

parameter

36.8

17.2

–

22.2

48.4

°C/W

ψJB

Junction-to-board

characterization

parameter

90.6

97.6

–

129.3

144.1

°C/W

RθJC(bot)

Junction-to-case

(bottom) thermal

resistance

N/A

–

N/A

5.4

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metric application report.

TL081, TL081A, TL081B, TL081H

TL082, TL082A, TL082B, TL082H

TL084, TL084A, TL084B, TL084H

SLOS081O – FEBRUARY 1977 – REVISED SEPTEMBER 2025

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