AD9744

Rev. B | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

With Respect to

Min

Max

Unit

AVDD

ACOM

−0.3

+3.9

V

DVDD

DCOM

−0.3

+3.9

V

CLKVDD

CLKCOM

−0.3

+3.9

V

ACOM

DCOM

−0.3

+0.3

V

ACOM

CLKCOM

−0.3

+0.3

V

DCOM

CLKCOM

−0.3

+0.3

V

AVDD

DVDD

−3.9

+3.9

V

AVDD

CLKVDD

−3.9

+3.9

V

DVDD

CLKVDD

−3.9

+3.9

V

CLOCK, SLEEP

DCOM

−0.3

DVDD + 0.3

V

Digital Inputs, MODE

DCOM

−0.3

DVDD + 0.3

V

IOUTA, IOUTB

ACOM

−1.0

AVDD + 0.3

V

REFIO, REFLO, FS ADJ

ACOM

−0.3

AVDD + 0.3

V

CLK+, CLK−, CMODE

CLKCOM

−0.3

CLKVDD + 0.3

V

Junction Temperature

150

°C

Storage Temperature

−65

+150

°C

Lead Temperature (10 sec)

300

°C

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is

not implied. Exposure to absolute maximum ratings for extended periods may effect device reliability.

THERMAL CHARACTERISTICS1

Thermal Resistance

28-Lead 300-Mil SOIC

28-Lead TSSOP

32-Lead LFCSP

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.