Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................4

6.4 Thermal Information....................................................4

6.5 Electrical Characteristics.............................................5

6.6 Typical Characteristics................................................ 6

7 Detailed Description...................................................... 11

7.1 Overview................................................................... 11

7.2 Functional Block Diagrams....................................... 11

7.3 Feature Description...................................................12

7.4 Device Functional Modes..........................................12

8 Application and Implementation.................................. 13

8.1 Application Information............................................. 13

8.2 Typical Application.................................................... 13

8.3 What To Do and What Not To Do..............................15

9 Power Supply Recommendations................................15

10 Layout...........................................................................15

10.1 Layout Guidelines................................................... 15

10.2 Layout Example...................................................... 16

11 Device and Documentation Support..........................17

11.1 Device Support........................................................17

11.2 Documentation Support.......................................... 17

11.3 Receiving Notification of Documentation Updates.. 17

11.4 Support Resources................................................. 17

11.5 Trademarks............................................................. 18

11.6 Electrostatic Discharge Caution.............................. 18

11.7 Glossary.................................................................. 18

12 Mechanical, Packaging, and Orderable

Information.................................................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision K (January 2015) to Revision L (September 2021)

Page

• Added PSRR value at 10 kHz to Features bullet................................................................................................1

• Added missing packages to Features bullet....................................................................................................... 1

• Changed SOT to SOT-23-THIN and SON to WSON throughout document....................................................... 1

• Changed Applications bullets............................................................................................................................. 1

• Changed body size for DSBGA package in Device Information table................................................................ 1

• Changed YZY package to YZU in Pin Functions table (typo).............................................................................3

• Added note (1) to Recommended Operating Conditions; moved from Electrical Characteristics ..................... 4

• Deleted Input Voltage from Electrical Characteristics; already shown in Recommended Operating Conditions

............................................................................................................................................................................5

• Deleted Junction Temperature from Electrical Characteristics; already shown in Recommended Operating

Conditions ..........................................................................................................................................................5

• Changed Do's and Don'ts title to What To Do and What Not To Do ................................................................ 15

Changes from Revision J (August 2010) to Revision K (January 2015)

Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................. 1

• Changed Features list ........................................................................................................................................1

• Changed Description section..............................................................................................................................1

• Changed figure on front page; replaced device pinouts with application circuits............................................... 1

• Changed Pin Configuration and Functions section; updated table format, renamed pin packages................... 3

• Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings ...............4

• Changed free-air to junction in Recommended Operating Conditions table conditions..................................... 4

• Added thermal information for additional device packages ............................................................................... 4

TPS799

SBVS056L – JANUARY 2005 – REVISED FEBRUARY 2022

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