PRELIMINARY
CYP15G0401TB
Document #: 38-02112 Rev. **
Page 29 of 30
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagram
HOTLink is a registered trademark, and HOTLink II, and MultiFrame are trademarks, of Cypress Semiconductor. IBM and ESCON
are registered trademarks, and FICON is a trademark, of International Business Machines. All product and company names
mentioned in this document are the trademarks of their respective holders.
Ordering Information
Speed
Ordering Code
Package Name
Package Type
Operating Range
Standard
CYP15G0401TB-BGC
BL256
256-ball Thermally Enhanced Ball Grid Array
Commercial
Standard
CYP15G0401TB-BGI
BL256
256-ball Thermally Enhanced Ball Grid Array
Industrial
Standard
CYP15G0401TB-BGXC
BL256
Pb Free 256-ball Thermally Enhanced Ball Grid
Array
Commercial
Standard
CYP15G0401TB-BGXI
BL256
Pb Free 256-ball Thermally Enhanced Ball Grid
Array
Industrial
A
B
0.15
C
0.15
C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
SEATING PLANE
SIDE VIEW
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
Ø0.15 M C
Ø0.30 M C
Ø0.75±0.15(256X)
B
A
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
TOP OF MOLD COMPOUND
TO TOP OF BALLS
26°
TYP.
A1 CORNER I.D.
0.50 MIN.
27.00±0.13
24.13
A1 CORNER I.D.
R 2.5 Max (4X)
256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
51-85123-*E
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