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ADRF5714BCCZN-R7 データシート(PDF) 6 Page - Analog Devices |
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ADRF5714BCCZN-R7 データシート(HTML) 6 Page - Analog Devices |
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6 / 14 page ![]() Data Sheet ADRF5714 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 6 of 14 For recommended operating conditions, see Table 1 and Table 2. Table 3. Absolute Maximum Ratings Parameter Rating VDD −0.3 V to +3.6 V VSS −3.6 V to +0.3 V Digital Control Inputs Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power1 Dual Supply (VDD = 3.3 V, VSS = −3.3 V, f = 100 MHz to 30 GHz, TCASE = 85°C2) Average 31 dBm Peak 34 dBm Hot Switching 31 dBm Single Supply (VDD = 3.3 V, VSS = 0 V, f = 100 MHz to 30 GHz, TCASE = 85°C2) Average 20 dBm Peak 20 dBm Hot Switching 20 dBm Unbiased Condition (VDD, VSS = 0 V) 15 dBm Temperature Junction (TJ) 135°C Storage −65°C to +150°C Reflow 260°C 1 For power derating over frequency, see Figure 2 and Figure 3. Applicable for all ATTIN and ATTOUT power specifications. 2 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 4. Thermal Resistance Package Type θJC1 Unit CC-12-6 50 °C/W 1 θJC was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C |
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