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EMIF08-VID01C2 データシート(PDF) 4 Page - STMicroelectronics |
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EMIF08-VID01C2 データシート(HTML) 4 Page - STMicroelectronics |
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4 / 6 page ![]() Ordering information scheme EMIF08-VID01C2 4/6 2 Ordering information scheme 3 Package information Figure 7. Flip-Chip Dimensions EMI Filter Number of lines X: resistance (Ohms) Z: capacitance value / 10 pF or Application (3 letters) and Version (2 digits) C: Coated flip chip 1: Pitch = 500 µm, Bump = 315 µm 2: Lead free Pitch = 500 µm, Bump = 315 µm EMIF vv - xxx zz C y Figure 8. Marking Figure 9. Footprint recommendation 695µm +/- 70 3.92 mm +/-50µm 500µm +/-50 315 µm +/- 50 250µm +/-50 -- - - 315 µm +/- 50 - - -- 315 µm +/- 50 - ® xx z y ww E ® xx z y ww ® xx z y ww Dot, ST logo xx = marking yww = date code (y = year ww = week) z = manufacturing location 250µm recommended, 300µm max 340µm min for 300µm copper pad diameter Copper pad Diameter: Solder stencil opening: 330µm Solder mask opening recommendation: |
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