EMIF08-VID01C2

Ordering information

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Figure 10.

Flip-Chip tape and reel specification

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

4

Ordering information

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Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.78 max

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

EMIF08-VID01C2

GS

Flip-Chip

7.4mg

4000

7” Tape and reel

Date

Revision

Changes

13-Jul-2005

1

Initial release.

11-Aug-2005

2

Fonts changed in Figures 7, 8, and 9.

31-May-2006

3

Reformatted to current standards. Depth dimension changed in

Figure 10.

26-Oct-2006

4

Base quantity changed to 4000 in Ordering information