MCP6V02-ESLASHMD datasheet(41/44 Pages) MICROCHIP

41 / 44 page

DS22058C-page 43

MCP6V01/2/3

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Device:

MCP6V01

Single Op Amp

MCP6V01T Single Op Amp

(Tape and Reel for 2x3 TDFN andSOIC)

MCP6V02

Dual Op Amp

MCP6V02T Dual Op Amp

(Tape and Reel for 4×4 DFN and SOIC)

MCP6V03

Single Op Amp with Chip Select

MCP6V03T Single Op Amp with Chip Select

(Tape and Reel for SOIC)

Temperature Range:

= -40°C to +125°C

Package:

= Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead

(MCP6V02 only)

MNY * = Plastic Dual Flat No Lead (2x3x0.75 mm), 8-lead

(MCP6V01, MCP6V03)

= Plastic SOIC (150mil Body), 8-lead

* Y = nickel palladium gold manufacturing designator. Only

available on the TDFN package.

PART NO.

–X

/XXX

Package

Temperature

Range

Device

Examples:

MCP6V01T-E/SN: Extended temperature,

8LD SOIC package.

MCP6V01-E/MNY:Extended temperature,

8LD 2x3 TDFN package.

MCP6V02-E/MD: Extended temperature,

8LD 4x4 DFN package.

MCP6V02T-E/SN: Tape and Reel,

Extended temperature,

8LD SOIC package.

MCP6V03-E/SN: Extended temperature,

8LD SOIC package.

MCP6V03-E/MNY:Extended temperature,

8LD 2x3 TDFN package.

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