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DD331 データシート(PDF) 8 Page - Silicon Touch Technology Inc. |
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DD331 データシート(HTML) 8 Page - Silicon Touch Technology Inc. |
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8 / 11 page ![]() 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. DD331 High CONSTANT CURRENT LED DRIVERS Version:A.002 Page 7 Typical Application DD331 Application Notice Notice the Rext applies to lower than 5 Ω, the wire resistance(Rwire) will affect Iout a lot. For example, when Rext=5Ω Iout= 104mA, if Rwire=1Ω, than Iout will decrease 1.96%. Due to large current flow through rext, it needs high power resistor to apply to prevent element burn out issue. Dissipation Ratings PACKAGE POWER DISSAPATION ( Tj_max=150 oC ) THERMAL RESISTANCE ( Rth(junction-to-air), Ta=25 oC ) SOP16 1.7 W 72.1 oC/W SSOP16 1.5 W 82 oC/W Power Dissipation Notice that the power dissipation of a semiconductor chip is limited to its package and ambient temperature, in which the device requires the maximum output current calculated for given operating conditions. The maximum allowable power consumption can be calculated by the following equation: Tj(junction temperature)(max)( C) - Ta(ambient temperature)( C) Pd(max)(Watt) = Rth(junction- to- air thermal resistance)( C/Watt) °° ° |
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