1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Dual Schottky Barrier Diodes

Application circuit designs are moving toward the consolidation of device count and

into smaller packages. The new SOT–363 package is a solution which simplifies

circuit design, reduces device count, and reduces board space by putting two discrete

devices in one small six–leaded package. The SOT–363 is ideal for low–power

surface mount applications where board space is at a premium, such as portable

products.

Surface Mount Comparisons:

SOT–363

SOT–23

Area (mm2)

4.6

7.6

Max Package PD (mW)

120

225

Device Count

2

1

Space Savings:

Package

1

 SOT–23

2

 SOT–23

SOT–363

40%

70%

The MBD110DW, MBD330DW, and MBD770DW devices are spin–offs of our

popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT–23 devices. They

are designed for high–efficiency UHF and VHF detector applications. Readily

available to many other fast switching RF and digital applications.

• Extremely Low Minority Carrier Lifetime

• Very Low Capacitance

• Low Reverse Leakage

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Reverse Voltage

MBD110DWT1

MBD330DWT1

MBD770DWT1

VR

7.0

30

70

Vdc

Forward Power Dissipation

TA = 25°C

PF

120

mW

Junction Temperature

TJ

– 55 to +125

°C

Storage Temperature Range

Tstg

– 55 to +150

°C

DEVICE MARKING

MBD110DWT1 = M4

MBD330DWT1 = T4

MBD770DWT1 = H5

Thermal Clad is a trademark of the Bergquist Company.

Preferred devices are Motorola recommended choices for future use and best overall value.

Order this document

by MBD110DWT1/D

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBD110DWT1

MBD330DWT1

MBD770DWT1

CASE 419B–01, STYLE 6

SOT–363

1

2

3

6

5

4

Motorola Preferred Devices