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LSM320HAY30 データシート(PDF) 19 Page - STMicroelectronics |
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LSM320HAY30 データシート(HTML) 19 Page - STMicroelectronics |
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19 / 42 page ![]() LSM320HAY30 Application hints Doc ID 16917 Rev 1 19/42 5.3 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com. |
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