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MPC5123 データシート(PDF) 82 Page - Freescale Semiconductor, Inc |
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MPC5123 データシート(HTML) 82 Page - Freescale Semiconductor, Inc |
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82 / 86 page  MPC5121E/MPC5123 Data Sheet, Rev. 4 Package Information Freescale Semiconductor 82 5 Package Information This section details package parameters and dimensions. The MPC5121e/MPC5123 is available in a Thermally Enhanced Plastic Ball Grid Array (TEPBGA), see Section 5.1, “Package Parameters,” and Section 5.2, “Mechanical Dimensions,” for information on the TEPBGA. 5.1 Package Parameters 5.2 Mechanical Dimensions Figure 64 shows the mechanical dimensions and bottom surface nomenclature of the MPC5121e/MPC5123 516 PBGA package. Table 53. TEPBGA Paramaters Package outline 27 mm × 27 mm Interconnects 516 Pitch 1.00 mm Module height (typical) 2.25 mm Solder Balls 96.5 Sn/3.5Ag (VY package) Ball diameter (typical) 0.6 mm |
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