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PCF8531 データシート(PDF) 9 Page - NXP Semiconductors

部品番号 PCF8531
部品情報  34 x 128 pixel matrix driver
PDF  51 Pages
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メーカー  NXP [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8531 データシート(HTML) 9 Page - NXP Semiconductors

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PCF8531
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 10 August 2010
9 of 51
NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
R12
93
−5366.4
−821.7
LCD row driver output
R14
94
−5296.4
−821.7
R16
95
−5226.4
−821.7
R18
96
−5156.4
−821.7
R20
97
−5086.4
−821.7
R22
98
−5016.4
−821.7
R24
99
−4946.4
−821.7
R26
100
−4876.4
−821.7
R28
101
−4806.4
−821.7
R30
102
−4736.4
−821.7
R32
103
−4666.4
−821.7
C0
104
−4526.4
−821.7
LCD column driver output
C1
105
−4456.4
−821.7
C2
106
−4386.4
−821.7
C3
107
−4316.4
−821.7
C4
108
−4246.4
−821.7
C5
109
−4176.4
−821.7
C6
110
−4106.4
−821.7
C7
111
−4036.4
−821.7
C8
112
−3966.4
−821.7
C9
113
−3896.4
−821.7
C10
114
−3826.4
−821.7
C11
115
−3756.4
−821.7
C12
116
−3688.4
−821.7
C13
117
−3616.4
−821.7
C14
118
−3546.4
−821.7
C15
119
−3476.4
−821.7
C16
120
−3406.4
−821.7
C17
121
−3336.4
−821.7
C18
122
−3266.4
−821.7
C19
123
−3196.4
−821.7
C20
124
−3126.4
−821.7
C21
125
−3056.4
−821.7
C22
126
−2986.4
−821.7
C23
127
−2916.4
−821.7
C24
128
−2846.4
−821.7
C25
129
−2776.4
−821.7
C26
130
−2706.4
−821.7
C27
131
−2636.4
−821.7
Table 5.
Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (
μm)
Y (
μm)
Description



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