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K6R1016C1 データシート(PDF) 3 Page - Samsung semiconductor |
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K6R1016C1 データシート(HTML) 3 Page - Samsung semiconductor |
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3 / 11 page ![]() K6R1016V1D CMOS SRAM Revision 3.0 - 3 - June 2002 for AT&T 64K x 16 Bit High-Speed CMOS Static RAM(3.3V Operating) The K6R1016V1D is a 1,048,576-bit high-speed Static Random Access Memory organized as 65,536 words by 16 bits. The K6R1016V1D uses 16 common input and output lines and has at output enable pin which operates faster than address access time at read cycle. Also it allows that lower and upper byte access by data byte control (UB, LB). The device is fabricated using SAMSUNG ′s advanced CMOS process and designed for high-speed circuit technology. It is particularly well suited for use in high-density high-speed system applications. The K6R1016V1D is packaged in a 400mil 44-pin plastic SOJ or TSOP2 forward or 48-TBGA. GENERAL DESCRIPTION FEATURES • Fast Access Time 8,10ns(Max.) • Low Power Dissipation Standby (TTL) : 20mA(Max.) (CMOS) : 5mA(Max.) Operating K6R1016V1D- 08: 80mA(Max.) K6R1016V1D-10: 65mA(Max.) • Single 3.3V Power Supply • TTL Compatible Inputs and Outputs • Fully Static Operation - No Clock or Refresh required • Three State Outputs • Center Power/Ground Pin Configuration • Data Byte Control: LB: I/O1~ I/O8, UB: I/O9~ I/O16 • Standard Pin Configuration: K6R1016V1D-J: 44-SOJ-400 K6R1016V1D-T: 44-TSOP2-400BF K6R1016V1D-E: 48-TBGA ( 6.0mm X 7.0mm ) with 0.75mm ball pitch • Operating in Commercial and Industrial Temperature range. Clk Gen. I/O1~I/O8 OE UB CS FUNCTIONAL BLOCK DIAGRAM Data Cont. Column Select A10 A11 A12 A13 A14 A15 CLK Gen. Pre-Charge Circuit Memory Array 512 Rows 128x16 Columns I/O Circuit & A0 I/O9~I/O16 Data Cont. WE LB A1 A2 A3 A4 A5 A6 A7 A9 A8 PIN FUNCTION Pin Name Pin Function A0 - A15 Address Inputs WE Write Enable CS Chip Select OE Output Enable LB Lower-byte Control(I/O1~I/O8) UB Upper-byte Control(I/O9~I/O16) I/O1 ~ I/O16 Data Inputs/Outputs VCC Power(+3.3V) VSS Ground N.C No Connection |
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