C5NPD0-DS datasheet(93/100 Pages) FREESCALE

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Marking Codes

V 04

Marking Codes

Table 58 explains the marking on the C-5 NP.

Reflow

Typical Reflow Profile for the C-5 Switch Module

1 Follow the guidelines recommended by your solder paste supplier.

Flux requrements must be met for best solderability.

2 The temperature profile should be carefully characterized to ensure uniform

temperature across the board and package.

Solder ball voiding may be affected by ramp rates and dwell times below and above

liquidus.

Table 57 Package Measurements (Reference Figure 26 and Figure 27 for Symbols)

SYMBOL

DEFINITION

NOM. (MM)

MIN. (MM)

MAX. (MM)

Overall

5.63

5.31

5.95

Ball height

0.89

C4 and Die

0.88

Body thickness

2.26

2.07

2.53

Lid thickness

1.6

Body size

37.50

Ball footprint (X)

35.56

Body size

37.50

Ball footprint (Y)

35.56

Ball pitch

1.27

Ball diameter

0.89

Table 58 C-5 Network Processor Marking Codes

MARKING (EXPLANATION OF CODES)

Top

Logo/Part#/Country of Origin/Date Code

Bottom

N/A

Pin 1 Marking

Chamfered Corner

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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