SMM310

Silicon MEMS Microphone

Data Sheet

11

V1.1, 2008-05-28

Solder Reflow

Recommended Vacuum Handling

Figure 12

Recommended minimum distance between sound port hole and vacuum pick tool opening is

0.50 mm

Table 6

Solder Reflow Conditions

Solder Reflow Profile

Compliant to J-STD-020-C

Maximum Peak Temperature

260 °C

Number of Reflow

3 times reflow soldering

Board washing after Reflow

Board washing can damage the microphone if the sound inlet hole is

uncovered

Moisture Sensitivity Level

MSL 2 classified

0.5

mm MIN