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MIC25400 データシート(PDF) 3 Page - Micrel Semiconductor

部品番号 MIC25400
部品情報  2A Dual Output PWM Synchronous Buck Regulator IC
PDF  27 Pages
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メーカー  MICREL [Micrel Semiconductor]
ホームページ  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC25400 データシート(HTML) 3 Page - Micrel Semiconductor

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Micrel, Inc.
MIC25400
January 2011
3
M9999-020111-C
Pin Number
Pin Name
Pin Description
13
EN/DLY2
Enable/Delay 2 (Input): This pin can be used to disable VOUT2. When
used to disable VOUT2, this pin must be pulled down to ground in less
than 1µs for proper operation. It is also used for soft-start of the
output. Soft start capacitor range is 4.7nf to 22nf. See Functional
Description section for additional information.
14
PG2
Power Good 2 (Output) Open drain. Device is in the OFF state. i.e.,
high when output is within 90% of regulation
15
CS2
Current Sense 2 (Input) Place a resistor from SW2 to this pin to
program the current limit point from 0.5A to 2.7A
16
PGND2
Power Ground 2 (Input)
17
LSD2
Low-side Drive 2 (Output): External low-side N-Channel MOSFET
driver. Use 4.5V rated MOSFETs.
18
BST2
Boost 2 (Input): Provides voltage for high-side internal MOSFET for
Channel 2. Connect a 0.01µF capacitor from SW2 to BST2 pin and a
diode-to-PVDD.
19
SW2
Switch Node 2 (Output): Source of internal high-side power MOSFET.
20
VIND2
Supply voltage (Input): For the drain of internal high-side power
MOSFET 4.5V to 13.2V.
21
PVDD
5V Internal Linear Regulator (Output): PVDD is the external MOSFET
gate drive for LSD1 and LSD2 and an internal supply bus for the IC.
Connect to an external 1µF bypass capacitor. When VIN is <6V, this
regulator operates in drop-out mode. Connect VDD to VIN when VIN
<6V.
22
VIN
Supply voltage (Input): For the internal 5V linear regulator. 4.5V to
13.2V.
23
VIND1
Supply voltage (Input): For the drain of internal high-side power
MOSFET 4.5V to 13.2V.
24
SW1
Switch Node 1 (Output): Source of internal high-side power MOSFET.
EP
GND
Exposed thermal pad for package only. Connect to ground. Must
make a full connection to the ground plane to maximize thermal
performance of the package.



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