PCIMX536AVV8C datasheet(1/178 Pages) FREESCALE

部品番号	PCIMX536AVV8C

部品情報	Automotive and Infotainment Applications Processors

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メーカー	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX53AEC

Rev. 2, 5/2011

MCIMX53xA

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

1

Introduction

The MCIMX53xA (i.MX53xA) automotive

infotainment processor is Freescale Semiconductor’s

latest addition to a growing family of

multimedia-focused products offering high performance

processing with a high degree of functional integration

aimed at the growing automotive infotainment,

telematics, HMI, and display-based cluster markets. This

device includes 3D and 2D graphics processors, 1080i/p

video processing, and dual display, and provides a

variety of interfaces.

The i.MX53xA processor features Freescale’s advanced

implementation of the ARM™ core, which operates at

clock speeds as high as 800 MHz and interfaces with

DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800

DRAM memories. This device is well suited for

graphics rendering for HMI, navigation, high

performance speech processing with large databases,

video processing and display, audio playback, and many

other applications.

The flexibility of the i.MX53xA architecture allows for

its use in a wide variety of applications. As the heart of

i.MX53xA Automotive and

Infotainment Applications

Processors

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1.

Special Signal Considerations . . . . . . . . . . . . . . . 17

4.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1.

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17

4.2.

Power Supplies Requirements and Restrictions . 24

4.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 27

4.4.

Output Buffer Impedance Characteristics . . . . . . 34

4.5.

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38

4.6.

System Modules Timing . . . . . . . . . . . . . . . . . . . . 45

4.7.

External Peripheral Interfaces Parameters . . . . . . 67

4.8.

XTAL Electrical Specifications . . . . . . . . . . . . . . 148

5.

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 149

5.1.

Boot Mode Configuration Pins . . . . . . . . . . . . . . 149

5.2.

Boot Devices Interfaces Allocation . . . . . . . . . . . 150

5.3.

Power setup during Boot . . . . . . . . . . . . . . . . . . 151

6.

Package Information and Contact Assignments . . . . . 152

6.1.

19x19 mm Package Information . . . . . . . . . . . . . 152

6.2.

19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 171

7.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

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