High-Efficiency, 2A, Current-Mode

Synchronous, Step-Down Switching Regulator

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Power Dissipation

The MAX15053 is available in a 9-bump WLP package

the die temperature exceeds +150NC, the thermal-shut-

down protection is activated (see the Thermal-Shutdown

Protection section).

Layout Procedure

Careful PCB layout is critical to achieve clean and stable

operation. It is highly recommended to duplicate the

MAX15053 Evaluation Kit layout for optimum perfor-

mance. If deviation is necessary, follow these guidelines

for good PCB layout:

1) Connect the signal and ground planes at a single

point immediately adjacent to the GND bump of the

IC.

2) Place capacitors on IN and SS/REFIN as close as

possible to the IC and the corresponding pad using

direct traces.

3) Keep the high-current paths as short and wide as

possible. Keep the path of switching current short

and minimize the loop area formed by LX, the output

capacitors, and the input capacitors.

4) Connect IN, LX, and GND separately to a large cop-

per area to help cool the IC to further improve effi-

ciency.

5) Ensure all feedback connections are short and

direct. Place the feedback resistors and compensa-

tion components as close as possible to the IC.

6) Route high-speed switching nodes (such as LX)

away from sensitive analog areas (such as FB and

COMP).

Figure 5. Application Circuit for PWM Mode Operation

LX

GND

FB

COMP

22µF

OUTPUT

1.8V AT 2A

4.02kI

8.06kI

2.32kI

3.3nF

1µH

100pF

1.2I

1nF

20kI

22µF

IN

PGOOD

EN

ENABLE

SKIP

ON

OFF

22nF

SS/REFIN

MAX15053

INPUT

2.7V TO 5.5V