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SMT80C2 データシート(PDF) 19 Page - Emerson Network Power

部品番号 SMT80C2
部品情報  SIL/SMT80C2 Series
PDF  20 Pages
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メーカー  EMERSON-NETWORKPOWER [Emerson Network Power]
ホームページ  http://www.emersonnetworkpower.com
Logo EMERSON-NETWORKPOWER - Emerson Network Power

SMT80C2 データシート(HTML) 19 Page - Emerson Network Power

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Rev. 04.25.11
SIL/SMT80C2
19 of 20
Embedded Power for
Business-Critical Continuity
Technical Reference Note
MechanicalDrawings(cont'd)
SMT80C2-00SADJ-J
Footprint
.050 1.27
.100
TYP
2.54
21 PLACES
2.300 58.42
.040 1.02
2.320 58.93
2X 1.160 29.46
22JUN06
DETACHED LIST
7001259-J200
D
C
B
A
A
B
C
D
SCALE: 3 = 2
SIZE
CAD FILE:
DWG. NO.
B
SHEET 1 OF 2
TLA DRAWING
APPROVALS
DRAWN
ENGINEER
UNLESS OTHERWISE SPECIFIED
THIRD
DIMENSIONS ARE IN INCHES
TOLERANCES:
2 PLACE
3 PLACE
ANGLES
.03
MATERIAL
FINISH
-
-
1
2
3
4
5
6
7
8
8
7
6
5
4
3
PH. 952-941-1100
REV.
PROJECT USED ON:
7091259-0200
TITLE:
HOLE TOLERANCE:
2
1
ARTESYN TECHNOLOGIES
EDEN PRAIRIE, MN 55433
PROJECTION
A
UPPERCUT 80
ANGLE
DATE
.015
1
.005
M. HENNIES
M. HENNIES
22JUN06
NOTE:
1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE.
2. COSMETIC AND WORKMANSHIP PER 9300152-0000.
3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.
2.400 60.96
31.75
1.250
TYP
1.27
.050
(23X)
.040
TYP
1.02
(2X)
APPLY LIQUI-BOND BETWEEN HEATSINK
AND PCB. ADJUST APPLICATION STENCIL TO
KEEP EXCESS LIQUI-BOND TO A MINIMUM
1.57
.062
REF
REF .110 2.79
.710[18.03] MAX
.125 3.18
PART NUMBER
REV
DESCRIPTION
DRAFT
DATE
7091259-0200
A
RELEASE TO PRODUCTION
M. HENNIES
03/06/07
REVISION RECORD
Pin 1
00
.020 0.51
.040 1.02
1.195 30.35
1.270 32.26
1.290 32.77
FOOTPRINT
D
C
B
A
A
B
C
D
SIZE
DWG. NO.
B
SHEET 2 OF 2
FOOTPRINT
1
2
3
4
5
6
7
8
8
7
6
5
4
32
1
REV.
TITLE:
7091259-0200
A
KEEP OUT AREA
PCB OUTLINE
SMT PAD
.045X.070" (25X)



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