Data Sheet

ADDI9023

Rev. 0 | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD to VSS

−0.3 V to +3.9 V

VH to VL, VLL

−0.3 V to +25.0 V

VH to VSS

−0.3 V to +17.0 V

VL to VSS

−17.0 V to +0.3 V

VM to VSS

−6.0 V to +3.0 V

VMM to VSS

−6.0 V to +3.0 V

VLL to VSS

−17.0 V to +0.3 V

V1A to V9 to VSS

VL − 0.3 V to VH + 0.3 V

VDREN to VSS

−0.3 V to VDD + 0.3 V

Junction Temperature

150°C

Lead Temperature

(Soldering, 10 sec)

350°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θ

JA

Unit

40-Lead CSP_BGA

46

°C/W

ESD CAUTION