ADP1046ACPZ-R7 datasheet(10/96 Pages) AD

10 / 96 page

ADP1046

Data Sheet

Rev. 0 | Page 10 of 96

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (Continuous), VDD

4.2 V

Digital Pins: OUTA, OUTB, OUTC, OUTD,

OUTAUX, SR1, SR2, GATE, PGOOD1,

PGOOD2

−0.3 V to VDD + 0.3 V

VS3− to PGND, AGND, DGND

−0.3 V to +0.3 V

VS1, VS2, VS3+

−0.3 V to VDD + 0.3 V

RTD, ADD

−0.3 V to VDD + 0.3 V

CS1, CS2+, CS2−

−0.3 V to VDD + 0.3 V

FLAGIN, PSON

−0.3 V to VDD + 0.3 V

SDA, SCL

−0.3 V to VDD + 0.3 V

SHAREo, SHAREi

−0.3 V to VDD + 0.3 V

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Peak Solder Reflow Temperature

SnPb Assemblies (10 sec to 30 sec)

240°C

RoHS-Compliant Assemblies

(20 sec to 40 sec)

260°C

ESD Charged Device Model

1.5 kV

ESD Human Body Model

3.5 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

32-Lead LFCSP

44.4

6.4

°C/W

SOLDERING

It is important to follow the correct guidelines when laying out

the PCB footprint for the ADP1046 and when soldering the

part onto the PCB. For detailed information about these guide-

lines, see the AN-772 Application Note.

ESD CAUTION

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