SL3ICS1002 datasheet(19/56 Pages) NXP

19 / 56 page

139036

All information provided in this document is subject to legal disclaimers.

Product data sheet

COMPANY PUBLIC

Rev. 3.6 — 10 March 2011

139036

19 of 56

NXP Semiconductors

SL3ICS1002/1202

UCODE G2XM and G2XL

11. Handling information for Flip Chip Strap (FCS2, SOT1040)

11.1 Storage conditions

The following storage conditions are applicable if the FCS2 products are kept in their

original packing:

• Storage temperature: +15 °C to +30 °C

• Relative humidity:

max. 60 %

• Duration of storage:

max. 0.5 years

Deviating requirements have to be arranged with NXP Semiconductors.

11.2 Assembly conditions

11.2.1 General assembly recommendations

NXP recommends to use dedicated strap assembly equipment to prevent damage of the

FCS2 strap or the die itself.

In case of any doubts, the customer is constrained to contact NXP Semiconductors for

further clarification.

11.2.2 Antenna bonding

Mounting the FCS2 product onto the antenna can be done in multiple ways:

• Crimping

• Conductive gluing

• Soldering (possible, but not recommended by NXP Semiconductors)

11.2.3 Label converting

Generally, an optimization of the entire lamination process by label manufacturer is

recommended in order to minimize the stress onto the module and guarantee high

assembly yield. Roller diameter must not be smaller than 45 mm.

SL3ICS1002 データシート(PDF) 19 Page - NXP Semiconductors

SL3ICS1002 データシート(HTML) 19 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56

データシートダウンロード